The information was leaked through a letter to shareholders earlier this month, in which the Texas-based semiconductor company said it continued to work with "strategic customers" and hoped that it would " bring a new part of HPMS to the mobile phone market next year". The HPMS mentioned here are Cirrus Logic's line of mixed-signal chips, including the Taptic Engine haptic feedback driver module in the iPhone.
In a recent phone call with analysts, Cirrus Logic CEO John Forsyth narrowed the time frame for this new component to market to "the second half of next year", which coincides with the samples. The iPhone 15 Pro is due out in September.
Additionally, an investor note published last week suggests that the new component the semiconductor company is referring to is most likely its own. Taptic complements haptic buttons on iPhone 15 Pro.
In October, reputable analyst Ming-Chi Kuo said that the iPhone 15 Pro models will use the power button and volume up and down in a solid state, similar to the physical Home button on the two iPhone 7 and iPhone 8 models.
If this is true, the iPhone's haptic buttons are more resistant to water than traditional mechanical ones, while also eliminating some of the moving parts that can wear out or break down over time.
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